Overview

Finding the right compromises has been a challenge when designing power electronics systems for major home appliances and industrial applications using discrete IGBTs. The solutions in the market like fully insulated packages (Full-Paks) and discrete IGBTs with Iso-foils or ceramics, have proven to be expensive, low performing, difficult to handle, and inadequate for heat dissipation needs of the last generation´s high power density chips.

Key features
  • Design flexibility
  • High output power
  • Low cooling effort
  • High reliability
  • Electrical isolation
Applications
EV charging
Uninterruptible power supplies (UPS)
Photovoltaic
Residential air conditioning

Products

About

Advanced Isolation package concept

The Advanced Isolation represents Infineon´s answer to the limits reached by traditional packaging and isolation techniques. This new isolation package enables the highest power density, the best performance, and the lowest cooling effort thanks to an effective and reliable thermal path from chip to the heatsink.

This package concept is able to match the highest requirements in terms of performance, design flexibility, and ease of handling. By eliminating the need for thermal grease or thermal interface sheets, Advanced Isolation is able to deliver at least 35 percent lower thermal resistivity and at least 10 percent system cost reduction, helping designers lower system complexity, development time, and assembling costs.

Advanced Isolation represents the cutting-edge technology in isolated packages and eliminates all the boundaries and constraints that until now have limited the designers’ ability to realize more powerful, more compact, and highly differentiated systems.

Advanced Isolation features in detail

The fully isolated package offers a 100 percent isolated plug and play solution with a Viso of 3.0 kV for 1 sec. With best-in-class Rth(j–h) at 35 percent lower Rth(j-h) compared to Iso-foil and 50 percent lower Rth(j-h) compared to Full-Paks and the low coupling capacitance of 38 pF which is 36 percent lower than standard isolation foils and 25 percent lower than MICA (similar to Al2O3 ) it is the right choice for your design.

Advanced Isolation key benefits

The Advanced Isolated packages require a decreased heatsink size or enable an increased power density with up to 10°C lower Tc compared to standard TO-247 with isolation material and up to 20 percent Iout increase for higher power output. In addition, the decreased EMI filter size, the improved reliability, and easy paralleling possibility’s decrease system costs and enable complete manufacturing process control.

Advanced Isolation package concept

The Advanced Isolation represents Infineon´s answer to the limits reached by traditional packaging and isolation techniques. This new isolation package enables the highest power density, the best performance, and the lowest cooling effort thanks to an effective and reliable thermal path from chip to the heatsink.

This package concept is able to match the highest requirements in terms of performance, design flexibility, and ease of handling. By eliminating the need for thermal grease or thermal interface sheets, Advanced Isolation is able to deliver at least 35 percent lower thermal resistivity and at least 10 percent system cost reduction, helping designers lower system complexity, development time, and assembling costs.

Advanced Isolation represents the cutting-edge technology in isolated packages and eliminates all the boundaries and constraints that until now have limited the designers’ ability to realize more powerful, more compact, and highly differentiated systems.

Advanced Isolation features in detail

The fully isolated package offers a 100 percent isolated plug and play solution with a Viso of 3.0 kV for 1 sec. With best-in-class Rth(j–h) at 35 percent lower Rth(j-h) compared to Iso-foil and 50 percent lower Rth(j-h) compared to Full-Paks and the low coupling capacitance of 38 pF which is 36 percent lower than standard isolation foils and 25 percent lower than MICA (similar to Al2O3 ) it is the right choice for your design.

Advanced Isolation key benefits

The Advanced Isolated packages require a decreased heatsink size or enable an increased power density with up to 10°C lower Tc compared to standard TO-247 with isolation material and up to 20 percent Iout increase for higher power output. In addition, the decreased EMI filter size, the improved reliability, and easy paralleling possibility’s decrease system costs and enable complete manufacturing process control.

Documents

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